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            Products

            Latest Product

            AD211 Plus II

            Automatic Direct Eutectic Die Attach System

            Latest Product Lens Holder Attach System

            AD280 Plus

            Automatic High Precision Die Attach System

            Latest Product

            AD819 Series

            Automatic Die Attach System

            Latest Product

            AD8312 Plus Series

            Automatic Die Bonding System (12” wafer handling)

            Latest Product

            AD832U

            Automatic Eutectic Die Bonding System

            Latest Product

            AD838L-G2

            Automatic Die Attach System

            Latest Product Wafer Handling

            AD9212 Plus

            Automatic Flip Chip Bonding System (12” wafer handling)

            Latest Product

            AFC Plus

            Die Bonder and Flip Chip Bonder

            Latest Product Misc

            eClip Plus Series

            Automatic Clip Bonding System

            Latest Product

            FIREBIRD TCB Series

            Automatic Thermal Compression Bonding System

            Latest Product

            ISLinDA

            Automatic Die Bonding System (12” wafer handling)

            Latest Product

            NANO

            Die Bonder and Flip Chip Bonder

            Latest Product

            NOVA Plus

            Die Bonder and Flip Chip Bonder

            Latest Product

            NUCLEUS Series / NUCLEUS-XL Series

            Multi-Purpose Precision Pick & Place Tool

            Latest Product

            Photon

            Automatic High Precision Die Attach System

            AD100

            High Speed Epoxy Die Bonder (for Vertical LED Application)

            AD210 Plus

            Automatic Die Bonding System (6” wafer handling)

            AD830 Plus

            Automatic Epoxy Die Attach System (6” wafer handling)

            AD830P-Plus

            Automatic Die Bonder

            AD832i

            Automatic Die Bonding System (8” wafer handling)

            AD881 Series

            Automatic Epoxy Die Bonder

            SD8312

            Automatic Soft Solder Die Bonding System

            AD830 Plus-R

            Automatic Epoxy Die Attach System (6” wafer handling)

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