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            Products

            Latest Product Aluminium Bonder Ultrasonic Wedge Bonder

            AB589 Series

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            AD211 Plus II

            Automatic Direct Eutectic Die Attach System

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            AD280 Plus

            Automatic High Precision Die Attach System

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            AD819 Series

            Automatic Die Attach System

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            AD8312 Plus Series

            Automatic Die Bonding System (12” wafer handling)

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            AD832U

            Automatic Eutectic Die Bonding System

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            AD838L-G2

            Automatic Die Attach System

            Latest Product Wafer Handling

            AD9212 Plus

            Automatic Flip Chip Bonding System (12” wafer handling)

            Latest Product OPTO/LED Wire Bonding Equipment

            AERO Series

            Automatic Wire Bonder

            Latest Product Ball Bonder

            AeroLED

            For LED Applications

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            AFC Plus

            Die Bonder and Flip Chip Bonder

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            Apollo 200 Sputtering

            PVD 100-200 mm Wafer Processing

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